I can find no evidence that ASUS made a board simply named
"CUSL", sans suffix. The "CUSL2" series of boards ("CUSL2",
"CUSL2-M", "CUSL2-C" and "CUSL2-C BP", the latter being
the "Black Pearl Special Edition") all appear to be
based on either the i815E or i815EP.  The i815E is AKA
the "Solono 2", no doubt infulencing the "SL2" in the
board's name; I would think that the "CU" part would be a
reference to "Coppermine". The original Solano, however,
was the i815 (sans "E"), so if there *had* been a CUSL,
it probably would have used the i815. Nevertheless,
there appear to be no i815 boards made by ASUS. There's
no manuals or bios entries for these on ASUS's Taiwan web
or ftp sites, and Intel's Motherboard finder script at
http://appsr.intel.com/scripts-boards/default.asp lists
nothing from ASUS for the i815, although it does list the
CUSL2 series for the i815E.

BTW, The Asus CUSL2 boards use Intel's 4Mbit Firmware Hub,
in a PLCC package direct surface mounted to the board. Do
these work with linuxbios?

FWIW, ASUS does make a "CUSI" series, which is based on
the SiS 630E; it's possible that the "I" looked like an
"L"...  In this case, the "-M" model (uATX) appears to
have a 2Mbit flash, again in PLCC, again hard-soldered to
the board.  One could presumably upgrade that memory, but,
unless there's plated through-holes underneath the chip
to support a PLCC socket with soldertails, one would need
access to a reflow oven, or at least a rework station with a
board heater, to mount a surface-mount socket; it's kind of
tough to hand-solder pins that are completely underneath a
plastic part, even with a hot-air unit and solder paste.
Lacking that, it's probably down to soldering the J-leads
of each new chip by hand, or perhaps snipping the pins
just as they come out of the flash chip's package, and
using some manner of clip-on adapter. That is, unless I'm
missing something more obvious?

--Bob

On Fri, Apr 27, 2001 at 10:05:02PM -0600, Ronald G Minnich wrote:
> what chipset does ASUS CUSL use? anybody know?
> 
> ron

Reply via email to