On Sun, Sep 11, 2005 at 04:56:49PM -0400, Timothy Miller wrote:
> Thanks for digging up that info for us. I'm going to go back to
> Howard and talk to him about possibly using separate heat sinks. I
> think there's a space concern, however. Also, we have past experience
> with many of the heat sink glues failing, so we prefer to have some
> mounting holes and either screws or plastic thing holding the heat
> sinks down. Mounted without glue, you can also swap out the heat
> sink.
Yeah. And unless the heat sink is very small and light, you don't
want the IC solder joints stressed by its mass. Drop the board on the
floor, and you get 1000 G or more for around 15 mS. What a fine way to
cause intermittents!
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