Today's drop adds the template of build support for the first five boards on this list below:
*Board Vendor* *Board Model* *Build Code* *FPGA* *PCIe* *Status* Xilinx ML555 <http://www.xilinx.com/products/devkits/HW-V5-ML555-G.htm> “ml555” V5-LX50T Gen1 x8 Working Xilinx XUPV5 <http://www.xilinx.com/univ/xupv5-lx110t.htm> “xupv5” V5-LX110T Gen1 x1 In Process Xilinx ML605 <http://www.xilinx.com/products/devkits/EK-V6-ML605-G.htm> “ml605” V6-LX240T Gen2 x4 In Process Abekas <http://www.abekas.com/> Alder “alder” V5-LX50T Gen1 x8 In Process Echotek <http://www.mc.com/microsites/echotek/> DCM-V5-XMC <http://www.mc.com/products/boards/dcmv5.aspx> “dcmv5” V5-SX95T Gen1 x8 In Process HiTechGlobal <http://www.hitechglobal.com/Boards/PCIExpress_SFP+.htm> NetFPGA-10G “netfpga10g” V5-TX240T Gen1 x8 In Process In order to build a particular application for a particular board, use the make target <*application*>-<*board*>. So to build the reference application "oc1001" for the ML555 board you would say: *% make oc1001-ml555* We have some work to do to factor out the multiplicative (coupled) parts of this tuple. But this is how it is for now. There is no NDA content in the drop; however some 3rd party boards (Abekas, Echotek, HiTechGlobal) are now listed. + We have switched the V5-PCIe core from v1.11 to v1.12 + We now build the PCIe core from Verilog sources once; then link at ngdbuild to a common, pre-compiled, NGC object file. + The OpenCPI RPL Dataplane is substantially complete; Pull DMA is still untested in hardware; Interrupts are untested. + Application data path widths of 4B, 8B, 16B, and 32B are now available (early WMI and WSI width adaptation) each at 125, 250, or 500 MHz. -Shep *No Attachment - drop will follow as tar.-gz so this notice can pass spam filters.*
_______________________________________________ opencpi_dev mailing list [email protected] http://lists.opencpi.org/listinfo.cgi/opencpi_dev-opencpi.org
