If this is a typical mobo in a name brand PC, the model #'s are usually hidden, or hidden within the board's serial # or product ID #. They rarely use model #'s, and more infrequently use the actual mobo maker's model #. For instance, if Soyo made the board, it might be an "SY-6BA+IV knock-off", but the board won't be that exact board, it may be an SY-6BAxx (where "xx" is some special Soyo made for Dell) since it was made for a proprietary for Dell and will lack some features. What these features are, is usually anyone's guess since you never get a mobo manual with a name brand PC. That's just an example of course, I just used Soyo as an example.
As for the location of the #, it may be silk screened on the board by the CPU slot or AGP slot, or in the other cases where the model # is part of the serial # or product ID # it may be on a sticker next to one of the very edges of the board, or a sticker on the last PCI/ISA slot. They are rarely on the back-side of a board. Of course just because it's an Intel chipset doesn't mean Intel made the board. How the HSF unit (heatsink & fan unit) is removed depends on whether the CPU is a typical slot 1 SECC, or SECC2. In an SECC, there are NO "pins" that run completely through the ENTIRE CPU and HSF assembly, it's just two clips with four "holders" or "grabbers", or four separate clips. In either case, the parts that grab the CPU grab inside the CPU in 4 small slots. Depending on its retention mechanism, it can be easy or hard to remove. If there is no retention mechanism with levers, it can be hard to remove and **VERY CAREFULL** USE of a screwdriver is needed. If there's levers, that should be self-explanatory and are much easier. The good thing here is the SECC layout is more sturdy and much harder to do any damage to anything. With these, the actual CPU chip is internal and never makes contact with the HS. In the case of the SECC2 CPU, these are a BIG PAIN to remove and there's a trick to it which would be extremely difficult to convey in an email. These CPUs' "housing" is much thinner and the plastic housing is only on one side with the other side being the exposed bare CPU PCB (printed circuit board). There are 4 holes that run through the CPU PCB and plastic housing on the other side. There are several ways the HSF unit attaches to these, but they all employ some kind of "4 round posts" or pins with tiny clips that clip on to the posts to hold the assembly in place. Sometimes full length plastic or metal screws take the place of posts/pins. Sometimes there are posts that need screws on the end to hold things in place. Still other times it's just a simple "friction interference fit" with only friction holding things in place. In either instance, on these SECC2 CPU's, the actual BARE CPU chip is exposed and what makes contact with the HS, and what makes removal/installation very tricky. These HSF units must be removed and installed in sort of a pattern like you'd tighten lug nuts on a car wheel--but MUCH MORE critical. Anytime any pressure or force is applied to the CPU chip in an uneven fashion, the CPU chip can......uhhhh, "chip". :-) It can crack. Only about 1mm at a time TOPS for each post or pin can the assembly be worked loose and the inverse is true as well. Whether SECC or SECC2, the most important thing to remember when putting things back to together (other than good thermal compound), is the potential for an air gap. These slot one type CPU's (and Slot A on AMD) are of a questionable design with regards to the mating surfaces of the CPU and HSF unit. Many times there are noticeable air gaps and you'd be surprised about how many slot 1 CPU's are out there that are not even making contact with the HSF unit! You should NEVER accept this, and either another HSF unit must be tried, or sometimes the clips or retention levers on the SECC HSF unit can be bent to facilitate a perfect mating surface. In the case of the SECC2, there's not much that can be done there, but the good thing is it's rare that the SECC2 type has any air gaps. The way to see them, is to put the HSF unit on the CPU with **NO THERMAL COMPOUND**, then hold it edge-wise up to a light and look VERY VERY CAREFULLY for any light between the mating surface of the HS and CPU. You should see none. Once you're POSITIVE there's no air gap, then a VERY thin layer of thermal compound can be applied to one surface and it reassembled. As far as how the lock into the mobo, that is basically the same. The mobo doesn't care if the CPU is SECC or SECC2, however the mobo retention mechanisms on how the entire CPU & HSF assembly are held in place on the mobo are different. One will not work with the other. So, if you currently are using an SECC2 CPU & HSF unit and mobo retention mechanism, your new CPU will also have to be an SECC2 CPU, or you'll need a new HSF unit and mobo retention mechanism since none of these are interchangeable. If you have a tight fit for the CPU to mobo slot interface, then the retention mechanism is not that critical. -Clint Happy Holidays to all & God Bless Clint Hamilton, Owner http://OrpheusComputing.com ) http://ComputersCustomBuilt.com ----- Original Message ----- From: "Roger Carnell" <[EMAIL PROTECTED]> Thanks for that information, Clint. I'm used to working with AMD processors and aftermarket boards. I figured most of the same rules would apply to Intel, but didn't know if they might be more specific or critical about that stuff. The 850 with the 133 FSB was a misprint. I know this has the 440BX Chipset, (FW82443BX North, FW82371EB South) but can't find the actual model number of the board. Does Intel stamp them in a certain place? The MBs I've been around have an ink stamp that tells the model number. Maybe its on the solder side of the board? I would have to completely remove it to see the solder side because of the case design.What I've found on the Intel site is that there are 2 prefix letters, **440BX that determines the model number. At least I think that's correct. Maybe Dell has covered it up with one of their stickers. Is there anyway to get the heatsink off of the processor without breaking everything? I tried alittle but didn't want to get carried away. This has 4 plastic pins that stick through and they look like their "swedged" or something into the plastic cover side. The reason I would maybe like to get it off is because of the mounting and the way it locks into place. Some of the other processors look different in the way they lock into the board. I figured I would just switch the heatsink so it would fit my hold-down. Thanks again for the help. Roger C. ----- Original Message ----- From: "Support-OrpheusComputing.com" The CPU may work, it depends on the mobo model #, but it's only going to operate at the fastest CPU speed/bus speed that the mobo supports. If your mobo only supports 100mhz bus tops, and let's say for example its max multiplier is 6, this means the fastest CPU speed will be 600mhz. Most 440BX boards can support PIII's, but some only with 100mhz bus while others can support 100 and 133mhz bus. You may want to look into a slocket adapter and see if your mobo supports them. These can allow you to use an even faster socket 370 (aka PPGA) PIII on a slot 1 board. Unfortunately, it sometimes can be trial and error since most mobo manufacturers don't mention this. If you'd be happy with an 850mhz CPU, and if Dell says the mobo will support an 850mhz CPU @100mhz bus, then I'd get the 100mhz bus CPU to avoid any compatibility problems. BTW, I don't think there's such a thing anyway as a PIII 850 with 133mhz bus. That would mean a multiplier of about 6.4 which is impossible. The PIII's with 133mhz bus are those who's speeds end in multiples of 33 (633, 733, 766, 833, 866, etc.). Any one listed as 850mhz w/133mhz bus is either a misprint, or actually 800mhz. -Clint ----- Original Message ----- From: "Roger Carnell" <[EMAIL PROTECTED]> Hello, Does anyone know if Intel Pent. III , Slot 1, Processors are backward compatible as far as bus speed. Can I put a Processor with a 133 mhz bus on a board with 100 mhz bus? Will the faster processor just run at the slower speed? The Board has the 440BX chipset. This is a Dell PC with a 450 Mhz CPU and I want to put in an 850. Some of the 850s I'm finding are 133 bus speed. On the Dell website, it lists up to a 850 cpu but with a 100 mhz bus. I'm guessing that's all that will work but thought I would ask. Thanks, Roger C. ============= PCWorks Mailing List ================= Don't see your post? Check our posting guidelines & make sure you've followed proper posting procedures, http://pcworkers.com/rules.htm Contact list owner <[EMAIL PROTECTED]> Unsubscribing and other changes: http://pcworkers.com =====================================================
