Dennis, There is an option in Protel Software that lets you choose the 'tent' feature for vias... then the Gerbers produced will reflect exactly what you want done. You designate the tenting on the pads themselves, collectively or individually, I believe this is a better solution to having them figure out what I want done...
Best regards, Bill Brooks - KG6VVP PCB Design Engineer , C.I.D.+, C.I.I. Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510 e-mail:[EMAIL PROTECTED] http://www.dtwc.com http://pcbwizards.com -----Original Message----- From: Dennis Saputelli [mailto:[EMAIL PROTECTED] Sent: Monday, January 10, 2005 1:46 PM To: Protel EDA Discussion List Subject: Re: [PEDA] Tenting Phenomenon (Is it riskless) i recently sent a board to a new shop for us the notes said 'tent smallest vias' we did that in the gerbers as well they called and said they can't tent the vias unless they use dry film, but they usually use LPI i said, 'but we do this all the time!' they said 'well we can *cover* the vias with LPI but we can't *tent* them' so i guess there is a possibly significant issue of terminology about this Dennis Saputelli _______________________________________________________________________ Integrated Controls, Inc. Tel: 415-647-0480 EXT 107 2851 21st Street Fax: 415-647-3003 San Francisco, CA 94110 www.integratedcontrolsinc.com Brad Velander wrote: > Adeel, > I believe the issue you have mentioned about soldermask thickness variation was in regards to the old thick-film soldermask. Previously thick-film solderemask was not used for SMT assemblies because it's thickness could keep components lifted off their pads. With most thin-film or liquid soldermasks this is not an issue because they are not typically thick enough to cause this problem. > The other comments mentioned so far match with my experience/opinion as well. > > Sincerely, > Brad Velander > Senior PCB Designer > Northern Airborne Technology > 1925 Kirschner Rd., > Kelowna, BC, V1Y 4N7. > tel (250) 763-2329 ext. 225 > fax (250) 762-3374 > > > >>-----Original Message----- >>From: Adeel Malik [mailto:[EMAIL PROTECTED] >>Sent: Monday, January 10, 2005 5:06 AM >>To: [email protected] >>Subject: [PEDA] Tenting Phenomenon (Is it riskless) >> >>Hi All, >> I intend to tent vias under components to prevent them > >>from shorting the component body. But I have been told that "Solder mask > >>thickness can vary enough to cause issues. Also tenting could mean that >>debris in a via hole remains unremoved, and unremovable.". >>Can someone comment on this whether tenting is safe or not. >>If not, can I use silk screen layer to cover the exposed vias ?> >> >>Regards, >>Adeel Malik > > > > ____________________________________________________________ > You are subscribed to the PEDA discussion forum > > To Post messages: > mailto:[email protected] > > Unsubscribe and Other Options: > http://techservinc.com/mailman/listinfo/peda_techservinc.com > > Browse or Search Old Archives (2001-2004): > http://www.mail-archive.com/[email protected] > > Browse or Search Current Archives (2004-Current): > http://www.mail-archive.com/[email protected] > > ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[email protected] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[email protected] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected] ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[email protected] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[email protected] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
