Hi.
I have a QFN-10 footprint that I am creating. The data sheet shows a solder pad under the device (fill), 5 vias and 4 tracks all used for heat sinking. I placed a copper fill on the PCB component and placed 5 pads and tracks as shown in the data sheet. The 5 pads have designators that refer to 5 pins in the schematic component. The 5 pins all connect to GND. When I place the PCB part and pour a polygon GND it does not pick up on the fact that the fill, 5 pads and tracks are to be connected to GND. Is this the correct approach? http://focus.ti.com/lit/ds/symlink/tps63000.pdf Brad. ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[email protected] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[EMAIL PROTECTED] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
