Hi Danny, Thanks for the reply. Can you plz comment on the process details carrried out both in Wave Soldering and Reflow Soldering ?. Secondly, is there any alignment requirement for the SMD components being soldered by wave or reflow technique (e.g some fab houses recommend that rectangular SMD chips like SO-16 packages be placed parallel to the horizontal axis of the board so that pins on both sides receive equal intensity wave). Regards, Adeel
-----Original Message----- From: Danny Bishop [mailto:[EMAIL PROTECTED]] Sent: Friday, May 31, 2002 11:06 AM To: 'Protel EDA Forum' Subject: Re: [PEDA] Soldering Techniques HI Adeel Wave soldering is only choice for soldering through hole parts in bulk. You can potentially save money by putting SMD parts on the opposite side to the thru hole parts and solder them all in one go. Wave soldering is not as reliable as reflow however, and requires adherence to fairly restrictive placement rules, which limit the density. Reflow is more reliable, and allows a denser layout of SMD components, but is an extra process if you are already wave soldering the through hole parts. regards Danny > -----Original Message----- > From: Adeel Malik [mailto:[EMAIL PROTECTED]] > Sent: Friday, 31 May 2002 4:07 PM > To: Protel EDA Forum > Subject: [PEDA] Soldering Techniques > > > Most Board-Population vendors use two techniques for > soldering namely Wave > Soldering and Reflow Soldering. Can someone tell me about the > pros and cons > of each type (which type is better for High-density and High > Performance > boards) ?. > > Regards > ADEEL MALIK, > * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/proteledaforum@techservinc.com * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
