At 08/10/2003 18:12, [EMAIL PROTECTED] wrote:
Hi,
I'd like to use a large, unmasked, plated, copper pour, on a single layer, to
perform as a heat sink for a D-Pak regulator.
I need to quantify the thermal resistance of the copper pour to ambient. I
know it's based on copper thickness and copper area. I'm uncertain how to
boil
down to thermal resistance.
Any help or applicable links is appreciated.
Regards,
Steve
I was actually searching for something else, but found this link:
http://www.semiconductors.philips.com/acrobat/various/SC03_APPLICATION_NOTE_1.pdf
It might just be what you are looking for.
Good luck,
Leo
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