Re: [linux-pm] [PATCH RESEND] thermal: add generic cpufreq cooling implementation
On Mon, Sep 10, 2012 at 3:25 PM, Zhang Rui wrote: > Refreshed to remove the notifier mechanism as we do not have a real user of > it. > if there is no problem, I'll apply the whole patch set to thermal next tree. The removal of notification API looks fine. Thanks for refreshing this. Thanks, Amit Daniel > > From: Amit Daniel Kachhap > Date: Thu, 16 Aug 2012 17:11:40 +0530 > > This patchset introduces a new generic cooling device based on cpufreq > that can be used on non-ACPI platforms. As a proof of concept, we have > drivers for the following platforms using this mechanism now: > > * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. > * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git > imx6q_thermal) > > There is a small change in cpufreq cooling registration APIs, so a minor > change is needed for Freescale platforms. > > Brief Description: > > 1) The generic cooling devices code is placed inside driver/thermal/* >as placing inside acpi folder will need un-necessary enabling of acpi >code. This code is architecture independent. > > 2) This patchset adds generic cpu cooling low level implementation >through frequency clipping. In future, other cpu related cooling >devices may be added here. An ACPI version of this already exists >(drivers/acpi/processor_thermal.c) .But this will be useful for >platforms like ARM using the generic thermal interface along with the >generic cpu cooling devices. The cooling device registration API's >return cooling device pointers which can be easily binded with the >thermal zone trip points. The important APIs exposed are, > >a) struct thermal_cooling_device *cpufreq_cooling_register( > struct cpumask *clip_cpus) >b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) > > 3) Samsung exynos platform thermal implementation is done using the >generic cpu cooling APIs and the new trip type. The temperature sensor >driver present in the hwmon folder(registered as hwmon driver) is moved >to thermal folder and registered as a thermal driver. > > A simple data/control flow diagrams is shown below, > > Core Linux thermal <-> Exynos thermal interface <- Temperature Sensor > | | > \|/| > Cpufreq cooling device <--- > > TODO: > *Will send the DT enablement patches later after the driver is merged. > > This patch: > > Add support for generic cpu thermal cooling low level implementations > using frequency scaling up/down based on the registration parameters. > Different cpu related cooling devices can be registered by the user and > the binding of these cooling devices to the corresponding trip points can > be easily done as the registration APIs return the cooling device pointer. > The user of these APIs are responsible for passing clipping frequency . > The drivers can also register to recieve notification about any cooling > action called. > > Cc: Guenter Roeck > Cc: SangWook Ju > Cc: Durgadoss > Cc: Len Brown > Cc: Jean Delvare > Cc: Kyungmin Park > Cc: Kukjin Kim > Signed-off-by: Zhang Rui > Signed-off-by: Andrew Morton > Signed-off-by: Amit Daniel Kachhap > --- > Documentation/thermal/cpu-cooling-api.txt | 33 ++ > drivers/thermal/Kconfig | 11 + > drivers/thermal/Makefile |1 + > drivers/thermal/cpu_cooling.c | 450 > + > include/linux/cpu_cooling.h | 58 > 5 files changed, 553 insertions(+), 0 deletions(-) > create mode 100644 Documentation/thermal/cpu-cooling-api.txt > create mode 100644 drivers/thermal/cpu_cooling.c > create mode 100644 include/linux/cpu_cooling.h > > diff --git a/Documentation/thermal/cpu-cooling-api.txt > b/Documentation/thermal/cpu-cooling-api.txt > new file mode 100644 > index 000..6fe9cdb > --- /dev/null > +++ b/Documentation/thermal/cpu-cooling-api.txt > @@ -0,0 +1,33 @@ > +CPU cooling APIs How To > +=== > + > +Written by Amit Daniel Kachhap > + > +Updated: 12 May 2012 > + > +Copyright (c) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) > + > +0. Introduction > + > +The generic cpu cooling(freq clipping) provides registration/unregistration > APIs > +to the caller. The binding of the cooling devices to the trip point is left > for > +the user. The registration APIs returns the cooling device pointer. > + > +1. cpu cooling APIs > + > +1.1 cpufreq registration/unregistration APIs > +1.1.1 struct thermal_cooling_device *cpufreq_cooling_register( > + struct cpumask *clip_cpus) > + > +This interface function registers the cpufreq cooling device with the > name > +"thermal-cpufreq-%x". This api can support multiple instances of cpufreq > +cooling devices. > + > + clip_cpus: cpumask of cpus where the frequency constraints will happen. > + > +1.1.2 void c
Re: [linux-pm] [PATCH RESEND] thermal: add generic cpufreq cooling implementation
On Monday, September 10, 2012, Zhang Rui wrote: > Refreshed to remove the notifier mechanism as we do not have a real user of > it. > if there is no problem, I'll apply the whole patch set to thermal next tree. > > From: Amit Daniel Kachhap > Date: Thu, 16 Aug 2012 17:11:40 +0530 > > This patchset introduces a new generic cooling device based on cpufreq > that can be used on non-ACPI platforms. As a proof of concept, we have > drivers for the following platforms using this mechanism now: > > * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. > * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git > imx6q_thermal) > > There is a small change in cpufreq cooling registration APIs, so a minor > change is needed for Freescale platforms. > > Brief Description: > > 1) The generic cooling devices code is placed inside driver/thermal/* >as placing inside acpi folder will need un-necessary enabling of acpi >code. This code is architecture independent. > > 2) This patchset adds generic cpu cooling low level implementation >through frequency clipping. In future, other cpu related cooling >devices may be added here. An ACPI version of this already exists >(drivers/acpi/processor_thermal.c) .But this will be useful for >platforms like ARM using the generic thermal interface along with the >generic cpu cooling devices. The cooling device registration API's >return cooling device pointers which can be easily binded with the >thermal zone trip points. The important APIs exposed are, > >a) struct thermal_cooling_device *cpufreq_cooling_register( > struct cpumask *clip_cpus) >b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) > > 3) Samsung exynos platform thermal implementation is done using the >generic cpu cooling APIs and the new trip type. The temperature sensor >driver present in the hwmon folder(registered as hwmon driver) is moved >to thermal folder and registered as a thermal driver. > > A simple data/control flow diagrams is shown below, > > Core Linux thermal <-> Exynos thermal interface <- Temperature Sensor > | | > \|/| > Cpufreq cooling device <--- > > TODO: > *Will send the DT enablement patches later after the driver is merged. > > This patch: > > Add support for generic cpu thermal cooling low level implementations > using frequency scaling up/down based on the registration parameters. > Different cpu related cooling devices can be registered by the user and > the binding of these cooling devices to the corresponding trip points can > be easily done as the registration APIs return the cooling device pointer. > The user of these APIs are responsible for passing clipping frequency . > The drivers can also register to recieve notification about any cooling > action called. > > Cc: Guenter Roeck > Cc: SangWook Ju > Cc: Durgadoss > Cc: Len Brown > Cc: Jean Delvare > Cc: Kyungmin Park > Cc: Kukjin Kim > Signed-off-by: Zhang Rui > Signed-off-by: Andrew Morton > Signed-off-by: Amit Daniel Kachhap Can you please resend the patch inline (i.e. not as an attachment)? Rafael -- To unsubscribe from this list: send the line "unsubscribe linux-samsung-soc" in the body of a message to majord...@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
Re: [linux-pm] [PATCH RESEND] thermal: add generic cpufreq cooling implementation
On Monday, September 10, 2012, Rafael J. Wysocki wrote: > On Monday, September 10, 2012, Zhang Rui wrote: > > Refreshed to remove the notifier mechanism as we do not have a real user of > > it. > > if there is no problem, I'll apply the whole patch set to thermal next tree. > > > > From: Amit Daniel Kachhap > > Date: Thu, 16 Aug 2012 17:11:40 +0530 > > > > This patchset introduces a new generic cooling device based on cpufreq > > that can be used on non-ACPI platforms. As a proof of concept, we have > > drivers for the following platforms using this mechanism now: > > > > * Samsung Exynos (Exynos4 and Exynos5) in the current patchset. > > * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git > > imx6q_thermal) > > > > There is a small change in cpufreq cooling registration APIs, so a minor > > change is needed for Freescale platforms. > > > > Brief Description: > > > > 1) The generic cooling devices code is placed inside driver/thermal/* > >as placing inside acpi folder will need un-necessary enabling of acpi > >code. This code is architecture independent. > > > > 2) This patchset adds generic cpu cooling low level implementation > >through frequency clipping. In future, other cpu related cooling > >devices may be added here. An ACPI version of this already exists > >(drivers/acpi/processor_thermal.c) .But this will be useful for > >platforms like ARM using the generic thermal interface along with the > >generic cpu cooling devices. The cooling device registration API's > >return cooling device pointers which can be easily binded with the > >thermal zone trip points. The important APIs exposed are, > > > >a) struct thermal_cooling_device *cpufreq_cooling_register( > > struct cpumask *clip_cpus) > >b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev) > > > > 3) Samsung exynos platform thermal implementation is done using the > >generic cpu cooling APIs and the new trip type. The temperature sensor > >driver present in the hwmon folder(registered as hwmon driver) is moved > >to thermal folder and registered as a thermal driver. > > > > A simple data/control flow diagrams is shown below, > > > > Core Linux thermal <-> Exynos thermal interface <- Temperature > > Sensor > > | | > > \|/| > > Cpufreq cooling device <--- > > > > TODO: > > *Will send the DT enablement patches later after the driver is merged. > > > > This patch: > > > > Add support for generic cpu thermal cooling low level implementations > > using frequency scaling up/down based on the registration parameters. > > Different cpu related cooling devices can be registered by the user and > > the binding of these cooling devices to the corresponding trip points can > > be easily done as the registration APIs return the cooling device pointer. > > The user of these APIs are responsible for passing clipping frequency . > > The drivers can also register to recieve notification about any cooling > > action called. > > > > Cc: Guenter Roeck > > Cc: SangWook Ju > > Cc: Durgadoss > > Cc: Len Brown > > Cc: Jean Delvare > > Cc: Kyungmin Park > > Cc: Kukjin Kim > > Signed-off-by: Zhang Rui > > Signed-off-by: Andrew Morton > > Signed-off-by: Amit Daniel Kachhap > > Can you please resend the patch inline (i.e. not as an attachment)? Sorry, it was inline (obviously). I seem to be too tired. Please resend it to linux...@vger.kernel.org. The linux-pm list at linux-foundation.org is not functional any more. Thanks, Rafael -- To unsubscribe from this list: send the line "unsubscribe linux-samsung-soc" in the body of a message to majord...@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
