Read the Guide for the EMC Directive 2004/108/EC under the section for Components/Sub-assemblies.
Bob Heller 3M EMC Laboratory, 76-1-01 St. Paul, MN 55107-1208 Tel: 651-778-6336 Fax: 651-778-6252 ================================= Michael Derby <micha...@acbcert.com> wrote on 10/20/2011 05:40:04 AM: > From: > > Michael Derby <micha...@acbcert.com> > > To: > > <arto.hihn...@nokia.com>, <t.rafesth...@emitech.fr>, > <jan.coenra...@brynyago.com>, <arthur.vandermeij...@kema.com>, > <gerhard.lud...@bmwfj.gv.at>, <kevin.l...@dti.gsi.gov.uk>, > <krzysztof.sieczka...@ilim.poznan.pl>, <norbert.saalm...@kiwa.nl>, > <notified_b...@3ctest.co.uk>, <pablo.ne...@ec.europa.eu>, > <t...@ckccertification.com>, <tony.henriq...@rfi-global.com>, > <zacharias.bila...@ec.europa.eu>, <adriano.lav...@lge.com>, > <afern...@dcom.upv.es>, <afern...@upvnet.upv.es>, > <agiedrai...@rrt.lt>, <akr...@pcbc.gov.pl>, <anton.kohling@t- > online.de>, <antonio.azev...@anacom.pt>, > <apapadopou...@haicorp.com>, <barry.quin...@us.bureauveritas.com>, > <ba...@cartman.org.uk>, <benoit.stockbroe...@anpi.be>, <benthin@obl- > gmbh.de>, <bernd.jae...@siemens.com>, <bfag...@us.tuv.com>, > <bju...@ccsemc.com>, <bmatt...@dlsemc.com>, <bob.del...@us.ul.com>, > <br...@timcoengr.com>, <bstu...@dlsemc.com>, <bu...@unmz.cz>, > <c...@yes.york.ac.uk>, <carlo.casati...@gmail.com>, > <certificat...@laidler.co.uk>, <certyfika...@zetomkatowice.com.pl>, > <chris.marsh...@yorkemc.co.uk>, <ch...@emctech.com.au>, > <christian.sie...@lga.de>, <christoph.hau...@electrosuisse.ch>, > <ci...@telefication.com>, <circa_ec...@ing-services.de>, > <claude.lote...@belgacom.be>, <c...@delta.dk>, > <d_ime...@btconnect.com>, <dan.can...@ntscorp.com>, > <daniel.leg...@aib-vincotte.be>, <decrow...@elitetest.com>, > <dehe...@itaca.upv.es>, <d...@dare.nl>, > <dick.grootboe...@nl.thalesgroup.com>, <didier.lebl...@legrand.fr>, > <dswee...@dlsemc.com>, <e.coeu...@emitech.fr>, > <eric.colpa...@bipt.be>, <evan.go...@us.bureauveritas.com>, > <ezab...@labein.es>, <fnek...@ezu.cz>, <francesco.barbi...@imq.it>, > <francisco.broissin-c...@emsa.europa.eu>, > <frank.padi...@wylelabs.com>, <fransua.di...@icpe.ro>, > <gkie...@nwemc.com>, <gtros...@eqi.it>, > <harald.schind...@volkswagen.de>, <hernande...@inta.es>, > <hilton.c...@babt.com>, <ho...@acmetesting.com>, > <hubert.kl...@eu.sony.com>, <hu...@evpu.sk>, > <ian.bri...@assaabloyuk.com>, <ib...@ad-holdings.co.uk>, > <i...@iol.it>, <igor.min...@etsi.org>, <i...@modulouno.it>, > <istvan.se...@hu.tuv.com>, <j.j...@emitech.fr>, > <jacques.castel...@thurmelec.fr>, <jacques.delaballe@schneider- > electric.com>, <jamay...@mityc.es>, <jan.welin...@sp.se>, > <janusz.sam...@udt.gov.pl>, <jari.merik...@sgs.com>, > <jarl.fjerdin...@npt.no>, <jarodr...@at4wireless.com>, > <ja...@labein.es>, <jberkowit...@tecnologica.com>, <jean- > pierre.barb...@lcie.fr>, <jean.pique...@finances.gouv.fr>, > <jklin...@celectronics.com>, <jma...@metlabs.com>, <joh...@is.is>, > <john-dav...@emcgoggles.com>, <john.mcau...@cei.ie>, > <jose.pr...@eu.sony.com>, <juhani.mero...@ficora.fi>, > <jyrki.le...@nemko.com>, <k.knoe...@emcc.de>, <ka...@nhh.hu>, > <kenth.skogl...@intertek.com>, <klaus.kr...@vde.com>, > <kristiaan.carpent...@thomson.net>, > <kurt.lamedschwand...@arcs.ac.at>, <lada...@vus.sk>, > <laurent.lin...@snch.lu>, <len...@evpu.sk>, <leon....@siq.si>, > <lukow...@obl-gmbh.de>, <luoming...@gmail.com>, <m.bez...@vtupv.cz>, > <manuel.bar...@icp.pt>, <marc.cu...@agoria.be>, > <marc.schm...@cetecom.de>, <ma...@eltest.com.pl>, > <marian.poroschi...@renar.ro>, <mariano.giu...@telecomitalia.it>, > <marjan....@siq.si>, <mark.bog...@ec.europa.eu>, > <mark.hea...@tracglobal.com>, <martin.gr...@iti.co.uk>, > <maryjo.diberna...@nist.gov>, <mats.hans...@sonyericsson.com>, > <mberto...@celab.com>, <mbo...@retlif.com>, > <mcnico...@safenet.co.uk>, <mhunzi...@emc-testcenter.com>, > <mis...@panasonic-tc.de>, <mpzarag...@mityc.es>, <nick.hooper@RFI- > GLOBAL.COM>, <nick.wainwri...@yorkemc.co.uk>, <o.he...@emitech.fr>, > <o...@predom.com.pl>, <o...@gyl.fr>, <paul.ma...@cetim.fr>, > <p...@iep.pt>, <peter.linn...@siemens.com>, > <petri.lehti...@intertek.com>, <phess...@etci.ie>, > <pierre.gr...@ineris.fr>, <pieter.deb...@nl.tuv.com>, > <pva...@itczlin.cz>, <ramona.s...@nist.gov>, <ra...@pctestlab.com>, > <rehel...@mmm.com>, <richard.whit...@mira.co.uk>, <rob@hursley- > emc.co.uk>, <robert.de...@skynet.be>, > <roberto.pass...@sicomtesting.com>, <roger.ber...@nemko.com>, > <s.colclo...@samsung.com>, <sandie.cau...@lcie.fr>, > <sdwytas...@mmm.com>, <selck.be...@phoenix-testlab.de>, > <s...@tuv.at>, <silvano.chial...@emilab.it>, <s...@tuvam.com>, > <s...@verizon.net>, <snell.le...@siemic.com>, > <steinar.kristen...@dnv.com>, <stephan.winkelm...@bnetza.de>, > <step...@gaskill.biz>, <steve.ha...@tracglobal.com>, > <steve.hubb...@baclcorp.com>, 'EE Steve K WLL' <ste...@wll.com>, > <stian.m...@dnv.com>, <tacch...@reinnova.it>, > <t...@projectsetc.com>, <thomas.we...@mikes-tp.com>, > <tom.sangs...@jasonconsult.com>, <tomas.bodekl...@sp.se>, > <tony.maddo...@era.co.uk>, <tre...@conformance-services.com>, > <twh...@lsr.com>, <v.beauv...@ulg.ac.be>, <vb...@aol.com>, > <victo...@cecoforma.com>, <vlafrag...@primaricerca.it>, > <wolfgang.hoepf...@eu.panasonic.com>, > <wolfgang.landgr...@meg.mee.com>, <y.jude...@emitech.fr>, > <yuriy.litvi...@intertek.com>, <z...@fh-kempten.de>, > <zbigniew.joskiew...@pwr.wroc.pl> > > Date: > > 10/20/2011 05:40 AM > > Subject: > > RE: Application of EMC directive > > Forgive my ignorance, but…. Is a SIM card really a radio apparatus? > > I agree they are inside the phone when the R&TTE Directive is > applied to the phone but do they really require separate assessment? > > Maybe I am naïve in the ways of SIM cards. > > Michael. > > > Michael Derby > Regulatory Engineer > ACB Europe > > From: arto.hihn...@nokia.com [mailto:arto.hihn...@nokia.com <mailto:arto.hihn...@nokia.com> ] > Sent: 19 October 2011 14:54 > To: t.rafesth...@emitech.fr; jan.coenra...@brynyago.com; > arthur.vandermeij...@kema.com; gerhard.lud...@bmwfj.gv.at; > kevin.l...@dti.gsi.gov.uk; krzysztof.sieczka...@ilim.poznan.pl; > norbert.saalm...@kiwa.nl; notified_b...@3ctest.co.uk; > pablo.ne...@ec.europa.eu; t...@ckccertification.com; > tony.henriq...@rfi-global.com; zacharias.bila...@ec.europa.eu; > adriano.lav...@lge.com; afern...@dcom.upv.es; > afern...@upvnet.upv.es; agiedrai...@rrt.lt; akr...@pcbc.gov.pl; > anton.kohl...@t-online.de; antonio.azev...@anacom.pt; > apapadopou...@haicorp.com; barry.quin...@us.bureauveritas.com; > ba...@cartman.org.uk; benoit.stockbroe...@anpi.be; benthin@obl- > gmbh.de; bernd.jae...@siemens.com; bfag...@us.tuv.com; > bju...@ccsemc.com; bmatt...@dlsemc.com; bob.del...@us.ul.com; > br...@timcoengr.com; bstu...@dlsemc.com; bu...@unmz.cz; > c...@yes.york.ac.uk; carlo.casati...@gmail.com; > certificat...@laidler.co.uk; certyfika...@zetomkatowice.com.pl; > chris.marsh...@yorkemc.co.uk; ch...@emctech.com.au; > christian.sie...@lga.de; christoph.hau...@electrosuisse.ch; > ci...@telefication.com; circa_ec...@ing-services.de; > claude.lote...@belgacom.be; c...@delta.dk; d_ime...@btconnect.com; > dan.can...@ntscorp.com; daniel.leg...@aib-vincotte.be; > decrow...@elitetest.com; dehe...@itaca.upv.es; d...@dare.nl; > dick.grootboe...@nl.thalesgroup.com; didier.lebl...@legrand.fr; > dswee...@dlsemc.com; e.coeu...@emitech.fr; eric.colpa...@bipt.be; > evan.go...@us.bureauveritas.com; ezab...@labein.es; fnek...@ezu.cz; > francesco.barbi...@imq.it; francisco.broissin-c...@emsa.europa.eu; > frank.padi...@wylelabs.com; fransua.di...@icpe.ro; > gkie...@nwemc.com; gtros...@eqi.it; harald.schind...@volkswagen.de; > hernande...@inta.es; hilton.c...@babt.com; ho...@acmetesting.com; > hubert.kl...@eu.sony.com; hu...@evpu.sk; ian.bri...@assaabloyuk.com; > ib...@ad-holdings.co.uk; i...@iol.it; igor.min...@etsi.org; > i...@modulouno.it; istvan.se...@hu.tuv.com; j.j...@emitech.fr; > jacques.castel...@thurmelec.fr; jacques.delaballe@schneider- > electric.com; jamay...@mityc.es; jan.welin...@sp.se; > janusz.sam...@udt.gov.pl; jari.merik...@sgs.com; > jarl.fjerdin...@npt.no; jarodr...@at4wireless.com; ja...@labein.es; > jberkowit...@tecnologica.com; jean-pierre.barb...@lcie.fr; > jean.pique...@finances.gouv.fr; jklin...@celectronics.com; > jma...@metlabs.com; joh...@is.is; john-dav...@emcgoggles.com; > john.mcau...@cei.ie; jose.pr...@eu.sony.com; > juhani.mero...@ficora.fi; jyrki.le...@nemko.com; k.knoe...@emcc.de; > ka...@nhh.hu; kenth.skogl...@intertek.com; klaus.kr...@vde.com; > kristiaan.carpent...@thomson.net; kurt.lamedschwand...@arcs.ac.at; > lada...@vus.sk; laurent.lin...@snch.lu; len...@evpu.sk; > leon....@siq.si; lukow...@obl-gmbh.de; luoming...@gmail.com; > m.bez...@vtupv.cz; manuel.bar...@icp.pt; marc.cu...@agoria.be; > marc.schm...@cetecom.de; ma...@eltest.com.pl; > marian.poroschi...@renar.ro; mariano.giu...@telecomitalia.it; > marjan....@siq.si; mark.bog...@ec.europa.eu; > mark.hea...@tracglobal.com; martin.gr...@iti.co.uk; > maryjo.diberna...@nist.gov; mats.hans...@sonyericsson.com; > mberto...@celab.com; mbo...@retlif.com; mcnico...@safenet.co.uk; > mhunzi...@emc-testcenter.com; Michael Derby; mis...@panasonic-tc.de; > mpzarag...@mityc.es; nick.hoo...@rfi-global.com; > nick.wainwri...@yorkemc.co.uk; o.he...@emitech.fr; > o...@predom.com.pl; o...@gyl.fr; paul.ma...@cetim.fr; p...@iep.pt; > peter.linn...@siemens.com; petri.lehti...@intertek.com; > phess...@etci.ie; pierre.gr...@ineris.fr; pieter.deb...@nl.tuv.com; > pva...@itczlin.cz; ramona.s...@nist.gov; ra...@pctestlab.com; > rehel...@mmm.com; richard.whit...@mira.co.uk; r...@hursley-emc.co.uk; > robert.de...@skynet.be; roberto.pass...@sicomtesting.com; > roger.ber...@nemko.com; s.colclo...@samsung.com; > sandie.cau...@lcie.fr; sdwytas...@mmm.com; selck.bernd@phoenix- > testlab.de; s...@tuv.at; silvano.chial...@emilab.it; s...@tuvam.com; > s...@verizon.net; snell.le...@siemic.com; > steinar.kristen...@dnv.com; stephan.winkelm...@bnetza.de; > step...@gaskill.biz; steve.ha...@tracglobal.com; > steve.hubb...@baclcorp.com; EE Steve K WLL; stian.m...@dnv.com; > tacch...@reinnova.it; t...@projectsetc.com; thomas.weise@mikes- > tp.com; tom.sangs...@jasonconsult.com; tomas.bodekl...@sp.se; > tony.maddo...@era.co.uk; tre...@conformance-services.com; > twh...@lsr.com; v.beauv...@ulg.ac.be; vb...@aol.com; > victo...@cecoforma.com; vlafrag...@primaricerca.it; > wolfgang.hoepf...@eu.panasonic.com; wolfgang.landgr...@meg.mee.com; > y.jude...@emitech.fr; yuriy.litvi...@intertek.com; zam@fh- > kempten.de; zbigniew.joskiew...@pwr.wroc.pl > Subject: RE: Application of EMC directive > > > Hello all, > > > For SIM cards I assume it is reasonable to handle them under the > R&TTE directive as normal use of them is inside mobile phone. > > Other types of the cards à it depends how it is used by the end user. > > Kind Regards > Arto > > > > > > > > Subject: Application of EMC directive > > Hello, > > I submitted a question of application of the EMC Directive. > The EMC Directive does apply to smart cards, SIM cards and other > contact cards? > If so, what do you think the applicable standards? > > Thank you in advance for your help > > Best regards > > > Thierry RAFESTHAIN > Co Responsable de centre > > [image removed] > > 7, rue Georges Méliès > 69680 CHASSIEU > 04 78 40 66 55 > t.rafesth...@emitech.fr > www.emitech.fr > > - ---------------------------------------------------------------- This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. 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