Re: coretemp driver change on dual-die/package systems
On 一, 2019-02-11 at 06:13 -0800, Guenter Roeck wrote: > On 2/11/19 1:46 AM, Zhang Rui wrote: > > > > Hi, Jean and Guenter, > > > > Per the Intel Software Developer's Manual, which you can found at > > www.i > > ntel.com/sdm, when CPUID.1F is present, it is preferred over > > CPUID.B. > > > > New dual-die/package systems will see this difference: > > CPUID.0B enumerates the CPUs on each die as if they were in > > different packages. > > CPUID.1F enumerates the CPUs on each die within the same > > package. > > > > This will manifest in the sysfs physical_package_id attribute. ie. > > In > > the example above, CPUID.B would cause lscpu to show 2 packages, > > and > > CPUID.1F will cause lscpu to show 1 package. > > > > Also, with CPUID.B the concept of a package-scope MSR and a die- > > scope > > MSR are synonymous. With CPUID.1F, it is possible for some MSRs to > > have die-scope, and other MSRs to have package-scope. > > > > MSR_IA32_PACKAGE_THERM_STATUS is a die-scope MSR, thus we need to > > update the coretemp driver to become multi-die-aware when we > > support > > CPUID.1F. > > > > Previously, we create one hwmon device for each package, now we > > need to > > create one hwmon device for each die. > > But there is one problem left. For each coretemp hwmon device, the > > "temp1_input" attribute represents the temperature got from > > MSR_IA32_PACKAGE_THERM_STATUS, and "temp1_label" is "Package id X", > > where X is the logical package id. > > Now we create one hwmon device for each die, thus temp1_label can > > not > > use logical package id any more, because there are two dies in the > > same > > package. > > To me, there are two choices, > > 1. changing "temp1_label" from "Package id X" to "Package id Y", > > where > > Y is just a unique number instead of logical package id, say, using > > ida. > > 2. changing "temp1_label" from "Package id X" to "Package id X Die > > id > > Y", where Y is the die id. > > > > Question is I'm not sure how temp1_label is used and if this change > > will break any userspace, like lm-sensors? > > > Please feel free to change the label as it makes sense. I would > suggest option > 2 to avoid confusion. The string it reports is not part of the ABI > and > can be changed. It can be overwritten with sensors3.conf anyway, so > nothing > should depend on it. Good to know. Thanks for the clarification, Guenter! -rui > > Guenter
coretemp driver change on dual-die/package systems
Hi, Jean and Guenter, Per the Intel Software Developer's Manual, which you can found at www.i ntel.com/sdm, when CPUID.1F is present, it is preferred over CPUID.B. New dual-die/package systems will see this difference: CPUID.0B enumerates the CPUs on each die as if they were in different packages. CPUID.1F enumerates the CPUs on each die within the same package. This will manifest in the sysfs physical_package_id attribute. ie. In the example above, CPUID.B would cause lscpu to show 2 packages, and CPUID.1F will cause lscpu to show 1 package. Also, with CPUID.B the concept of a package-scope MSR and a die-scope MSR are synonymous. With CPUID.1F, it is possible for some MSRs to have die-scope, and other MSRs to have package-scope. MSR_IA32_PACKAGE_THERM_STATUS is a die-scope MSR, thus we need to update the coretemp driver to become multi-die-aware when we support CPUID.1F. Previously, we create one hwmon device for each package, now we need to create one hwmon device for each die. But there is one problem left. For each coretemp hwmon device, the "temp1_input" attribute represents the temperature got from MSR_IA32_PACKAGE_THERM_STATUS, and "temp1_label" is "Package id X", where X is the logical package id. Now we create one hwmon device for each die, thus temp1_label can not use logical package id any more, because there are two dies in the same package. To me, there are two choices, 1. changing "temp1_label" from "Package id X" to "Package id Y", where Y is just a unique number instead of logical package id, say, using ida. 2. changing "temp1_label" from "Package id X" to "Package id X Die id Y", where Y is the die id. Question is I'm not sure how temp1_label is used and if this change will break any userspace, like lm-sensors? thanks, rui
Re: [PATCH 0/9 v2] constify thermal_zone_of_device_ops structures
On Tue, 2017-08-08 at 17:08 +0200, Julia Lawall wrote: > The thermal_zone_of_device_ops structures are only passed as the > fourth > argument to thermal_zone_of_sensor_register or > devm_thermal_zone_of_sensor_register, both of which are declared as > const. > Thus the thermal_zone_of_device_ops structures themselves can be > const. > > v2: add structures passed to devm_thermal_zone_of_sensor_register > also. > > Done with the help of Coccinelle. > I don't see the patches changes out of drivers/thermal. As there is no dependencies between these patches, I guess I will only take patches that changes drivers/thermal. thanks, rui > --- > > drivers/hwmon/hwmon.c |2 +- > drivers/hwmon/scpi-hwmon.c |2 +- > drivers/input/touchscreen/sun4i-ts.c |2 +- > drivers/thermal/broadcom/bcm2835_thermal.c |2 +- > drivers/thermal/hisi_thermal.c |2 +- > drivers/thermal/qoriq_thermal.c|2 +- > drivers/thermal/rcar_gen3_thermal.c|2 +- > drivers/thermal/samsung/exynos_tmu.c |2 +- > drivers/thermal/zx2967_thermal.c |2 +- > 9 files changed, 9 insertions(+), 9 deletions(-) -- To unsubscribe from this list: send the line "unsubscribe linux-hwmon" in the body of a message to majord...@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
