On 3 March 2012 23:34, Guenter Roeck guenter.ro...@ericsson.com wrote:
On Sat, Mar 03, 2012 at 11:44:10AM -0500, Mark Brown wrote:
On Sat, Mar 03, 2012 at 04:36:05PM +0530, Amit Daniel Kachhap wrote:
This movement is needed because the hwmon entries and corresponding
sysfs interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in mfd folder
and add necessary calls to get the temperature information.
--- a/Documentation/hwmon/exynos4_tmu
+++ /dev/null
Moving this seems to be a failure, the device is exposing a hwmon
interface even if you've moved the code to mfd (though it doesn't
actually look like a multi-function device at all as far as I can see -
usually a MFD would have a bunch of unrelated functionality while this
has one function used by two subsystems).
If anything it looks like the ADC driver ought to be moved into IIO with
either generic or Exynos specific function drivers layered on top of it
in hwmon and thermal making use of the values that are read.
I would agree. Or maybe move it all to thermal, since thermal devices register
the hwmon subsystem.
Ok I agree with your suggestion of moving into thermal. Since I wanted
to separate exynos specific generic thermal implementation with the
H/W driver so that other versions of the sensor driver can easily hook
into the common part. Anyway this implementation seems possible.
Thanks for the comments
Guenter
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