Philipp Stanner wrote:
> Platforms like the x230 have two flash ROMs which are virtually treated
> as a single one.
..
>1. What the heck is the meaning of this? Why do vendors buy and solder
> two small chips (even worse, on the x230, one with 8M and one with
> 4M) instead of a
Hi Philipp,
there is some documentation you might have missed [1] (can't blame you,
the index is broken [2]).
On 18.09.19 23:23, Philipp Stanner wrote:
> Am Montag, den 16.09.2019, 07:20 -0700 schrieb Stefan Reinauer:
>> Yes, this is often done as a cost reduction method. The habit started
>>
Am Montag, den 16.09.2019, 07:20 -0700 schrieb Stefan Reinauer:
> Yes, this is often done as a cost reduction method. The habit started
> with the arrival of the ME and the firmware descriptor allowing you
> to spread your different firmware regions across one or both chips.
Hm, surprises me.
Yes, this is often done as a cost reduction method. The habit started with
the arrival of the ME and the firmware descriptor allowing you to spread
your different firmware regions across one or both chips. The tool ifdtool
will help you analyze images for Intel firmware descriptors.
Sounds like in
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