Re: [PATCH v2 0/3] net/bonding: support device private dump

2023-01-16 Thread Ferruh Yigit
On 12/15/2022 10:56 AM, lihuisong (C) wrote: > > 在 2022/12/14 17:55, humin (Q) 写道: >> >> 在 2022/12/14 14:13, Chengwen Feng 写道: >>> This patchset adds device private dump for bonding PMD, and use >>> rte_eth_dev_priv_dump API to implement testpmd show bonding command. >>> >>> Chengwen Feng (3): >

Re: [PATCH v2 0/3] net/bonding: support device private dump

2022-12-15 Thread lihuisong (C)
在 2022/12/14 17:55, humin (Q) 写道: Acked-by：Min Hu (Connor) Indeed, it is better to move them to bonding PMD. lgtm Series-acked-by: Huisong Li 在 2022/12/14 14:13, Chengwen Feng 写道: This patchset adds device private dump for bonding PMD, and use rte_eth_dev_priv_dump API to implement testpm

Re: [PATCH v2 0/3] net/bonding: support device private dump

2022-12-14 Thread humin (Q)
Acked-by：Min Hu (Connor) 在 2022/12/14 14:13, Chengwen Feng 写道: This patchset adds device private dump for bonding PMD, and use rte_eth_dev_priv_dump API to implement testpmd show bonding command. Chengwen Feng (3): net/bonding: support private dump ops net/bonding: support dump LACP info

[PATCH v2 0/3] net/bonding: support device private dump

2022-12-13 Thread Chengwen Feng
This patchset adds device private dump for bonding PMD, and use rte_eth_dev_priv_dump API to implement testpmd show bonding command. Chengwen Feng (3): net/bonding: support private dump ops net/bonding: support dump LACP info net/bonding: use dump API to impl show bonding cmd --- v2: * ad