; humi...@huawei.com
>> Subject: Re: [dpdk-dev] [RFC 0/2] add Tx prepare support for bonding device
>>
>> Hi
>> On 2021/4/20 16:33, Ananyev, Konstantin wrote:
>>> Hi everyone,
>>>
>>>>
>>>> On 2021/4/20 9:26, Ferruh Yigit wr
> -Original Message-
> From: Chengchang Tang
> Sent: Tuesday, April 20, 2021 1:44 PM
> To: Ananyev, Konstantin ; Yigit, Ferruh
> ; dev@dpdk.org
> Cc: linux...@huawei.com; ch...@att.com; humi...@huawei.com
> Subject: Re: [dpdk-dev] [RFC 0/2] add Tx prepare suppo
Hi
On 2021/4/20 16:33, Ananyev, Konstantin wrote:
> Hi everyone,
>
>>
>> On 2021/4/20 9:26, Ferruh Yigit wrote:
>>> On 4/16/2021 12:04 PM, Chengchang Tang wrote:
This patch add Tx prepare for bonding device.
Currently, the bonding driver has not implemented the callback of
rte_
Hi everyone,
>
> On 2021/4/20 9:26, Ferruh Yigit wrote:
> > On 4/16/2021 12:04 PM, Chengchang Tang wrote:
> >> This patch add Tx prepare for bonding device.
> >>
> >> Currently, the bonding driver has not implemented the callback of
> >> rte_eth_tx_prepare function. Therefore, the TX prepare func
On 2021/4/20 9:26, Ferruh Yigit wrote:
> On 4/16/2021 12:04 PM, Chengchang Tang wrote:
>> This patch add Tx prepare for bonding device.
>>
>> Currently, the bonding driver has not implemented the callback of
>> rte_eth_tx_prepare function. Therefore, the TX prepare function of the
>> slave devices
On 4/16/2021 12:04 PM, Chengchang Tang wrote:
This patch add Tx prepare for bonding device.
Currently, the bonding driver has not implemented the callback of
rte_eth_tx_prepare function. Therefore, the TX prepare function of the
slave devices will never be invoked. When hardware offloading such
Looks good to me.
在 2021/4/16 19:04, Chengchang Tang 写道:
This patch add Tx prepare for bonding device.
Currently, the bonding driver has not implemented the callback of
rte_eth_tx_prepare function. Therefore, the TX prepare function of the
slave devices will never be invoked. When hardware offl
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