Absolutely do not leave out the fillet.  If you have a lead that sticks out
of a hole, you should have a fillet around it.  That is a requirement of the
NASA soldering course of years ago, but has not changed as far as I see in
modern assemblies.

The flush plated thru hole is OK for solder bond to a lead, but you lose the
ability to clip on a test lead there.  Also, if ever you have to remove the
component, the extension of the lead out the plated thru hole gives you
something to grab; to wiggle the lead and break the solder bonds while the
solder is wet.  Continued movement of the lead keeps it from reattaching as
the solder cools, and facilitates removing the old component.

I think having a test point is as important as any of the other reasons for
not cutting leads flush.  Besides, the board has leaded components that will
stick thru and should not be cut, (are not designed to be cut) as I
mentioned in the earlier post. Those automatically determining that some
leads protrude thru the bottom of the board.

Now anyone is free to do what they want, but if I got a unit in my shop
years ago to repair that had been assembled with leads cut flush, I would
have to charge more for the aggravation of working on it, or refuse to
service it.

In building electronics, you should always design, lay out, and assemble to
facilitate future repairs.  Unfortunately, much of today's consumer
electronics is built to "throw away", but I doubt most hams would want to do
that with their kit when it has a simple failure that soldering in a new
component would fix.

I have followed the above in both design, modification, and selection of
professional science equipment for 45 years, and found that years after
something was obtained, attention to reparability saved the day when we had
to fix it.

-Stuart
K5KVH



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