Re: Adoption of IEC-60950 3rd Ed.

Hi Oscar, Please be advised that the IEC has replaced IEC60950 3rd Ed. with IEC60950-1:2001. Excerpted, the foreward of IEC60950-1 states "This first edition of IEC 60950-1 cancels and replaces the third edition of IEC 60950, issued in 1999, and constitutes a technical revision.". The countri

RE: EMC & SIX LAYER PCB

If this is what you feel in necessary at moderate frequencies (I believe the original discussion was related to 600 MHz), I'd hate to see what you might feel is required at high frequency. :) The idea of "chip in board" that you mention is not new. It was first tried in the Far East some years ag

Re: EMC & SIX LAYER PCB

Cortland Richmond <72146@compuserve.com> wrote: > Current flowing through a via or a capacitor creates a voltage drop >which drives the planes it connects, as a radiator. A good antenna >may be made out of planes connected by a via, with RF applied >between them. We need to avoid doing this