Brian,
I seem to remember hearing somewhere that lead-free solder joints, especially
ones that are fairly large solder joints, may show a higher amount of cracks
in the surface than SnPb joints of the same size. (I think the reasons had to
do with amount of thermal expansion and contraction, and
Good People,
I am performing a quality review on an unit based on IPC-A-610D.
Section 5.2.7 indicates that solder stress lines are acceptable for
lead-free solders, but not for leaded solders.
Does this make sense to anyone ? What great revelation am I missing ?
Thanks and luck,
Brian
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