Jim
"Douglas C. Smith" on 10/08/99 09:29:25 PM
Please respond to "Douglas C. Smith"
To: "UMBDENSTOCK, DON"
cc: "'EMC-PSTC Discussion Group'" (bcc: Jim
Hulbert/MSD/US/PBI)
Subject: Re: Printed Circuit Board Grounding
Hi Don,
You might want to consider whether the IEC61000-4-4 EFT/B (Electrical Fast
Transient/Burst) immunity test needs to be performed on the completed system.
One of the test steps involves injecting 1000V+ transients onto the green wire
(protective earth) of the equipment. Connecting your 'ground' (D
Hi Don,
Each situation should be evaluated on its own merits. I am going to list
some general rules of thumb below, but there may be exceptions. I have
done lots of ESD current measurements in different configurations and
base my opinions on these measurments and personal experience with
equipmen
om on 10/08/99 01:50:49 PM
Please respond to umbdenstock%sensormatic@interlock.lexmark.com
To: emc-pstc%ieee@interlock.lexmark.com
cc:(bcc: George Alspaugh/Lex/Lexmark)
Subject: Printed Circuit Board Grounding
Hello Group,
We are having a debate concerning the best practic
Hello Group,
We are having a debate concerning the best practice for grounding of a
printed circuit board containing digital logic. These boards are
multi-layer with a ground plane and a power plane.
One school of thought is to tie the ground plane to chassis ground in many
locations, thus re
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