Paul,
ANSI/EIA-625-1994 Requirements for Handling
Electrostatic-Discharge-Sensitive (ESDS) Devices
specifies that antistatic packaging shall not triboelectric charge to
greater than +/-200V; and workstation equipment 'shall not generate +/-200V
within twelve (12) inches of unprotected ESDS devices during use.'

EIA-625 explains how to handle ESDS devices; there is no distinction
regarding 'customer's semiconductors' or even 'semiconductors'.

David

-----Original Message-----
From: paul.j.sm...@teradyne.com [mailto:paul.j.sm...@teradyne.com]
Sent: Thursday, April 25, 2002 1:34 PM
To: emc-pstc (E-mail)
Subject: RE: Inquiry on standard specifying potential ESD hazard reduced
to a level BELOW 200V




Folks,

Is there a standard specifying that the potential ESD hazard Must Be
reduced to a level BELOW 200V ( or other max. voltage ) adjacent to any
location where a customer's Semiconductor Device Under Test might be
Handled or Contacted.

Your comments would be most appreciated.

Best Regards,            Paul J Smith
               Teradyne, Inc., Boston, MA 02111
               paul.j.sm...@teradyne.com


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