Anyone here going to this event?: http://www.globalsmt.net/smt/index.php?option=com_content&view=article&id=11580&Itemid=396
See Kyzen’s Rich Brooks Discuss "Concerns in Cleaning Under Low Profile Components at SMTAI 2010" SMTA International, scheduled to take place October 25-28, 2010 at the Walt Disney World. Would like to know what Mr. Brooks has to say. "The complete cleaning and removal of flux/soil residues under low profile components is becoming more critical, especially as the conductor spacings are decreasing and the power is increasing. If the residues are not completely removed, then the reliability of the circuit can be greatly affected. It is the combination of these technologies that make the cleaning process extremely difficult. Therefore, the cleaning process must be carefully examined and optimized to obtain maximum performance for removing the flux residues. During the cleaning process, the cleaning chemistry must wet, dissolve, penetrate the flux dam and flow under the component to adequately remove all flux residues. This paper will review the cleaning problems brought about with the implementation of the latest technologies and explain how the cleaning process can be optimized to guarantee the reliability of the assemblies." Cleaning under QFN, and like, packages is still an industry wide problem, especially when you are running off batteries and need low leakage currents. _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user