On Thu, 2020-11-26 at 09:18 -0800, Srinivas Pandruvada wrote:
> The Processor Thermal PCI device supports multiple features.
> Currently
> we export only RAPL. But we need more features from this device
> exposed
> for Tiger Lake and Alder Lake based platforms. So re-structure the
> current MMIO
The Processor Thermal PCI device supports multiple features. Currently
we export only RAPL. But we need more features from this device exposed
for Tiger Lake and Alder Lake based platforms. So re-structure the
current MMIO interface, so that more features can be added cleanly.
No functional
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