Re: [PATCH 1/7] soc: mediatek: Add USB wakeup driver

2017-12-20 Thread Chunfeng Yun
On Fri, 2017-12-15 at 14:55 -0600, Rob Herring wrote: > On Sat, Dec 09, 2017 at 04:45:30PM +0800, Chunfeng Yun wrote: > > This driver is used to support usb wakeup which is controlled by > > the glue layer between SSUSB and SPM. Usually the glue layer is put > > into a system controller, such as

Re: [PATCH 1/7] soc: mediatek: Add USB wakeup driver

2017-12-20 Thread Chunfeng Yun
On Fri, 2017-12-15 at 14:55 -0600, Rob Herring wrote: > On Sat, Dec 09, 2017 at 04:45:30PM +0800, Chunfeng Yun wrote: > > This driver is used to support usb wakeup which is controlled by > > the glue layer between SSUSB and SPM. Usually the glue layer is put > > into a system controller, such as

Re: [PATCH 1/7] soc: mediatek: Add USB wakeup driver

2017-12-15 Thread Rob Herring
On Sat, Dec 09, 2017 at 04:45:30PM +0800, Chunfeng Yun wrote: > This driver is used to support usb wakeup which is controlled by > the glue layer between SSUSB and SPM. Usually the glue layer is put > into a system controller, such as pericfg module, which is > represented by a syscon node in DTS.

Re: [PATCH 1/7] soc: mediatek: Add USB wakeup driver

2017-12-15 Thread Rob Herring
On Sat, Dec 09, 2017 at 04:45:30PM +0800, Chunfeng Yun wrote: > This driver is used to support usb wakeup which is controlled by > the glue layer between SSUSB and SPM. Usually the glue layer is put > into a system controller, such as pericfg module, which is > represented by a syscon node in DTS.

[PATCH 1/7] soc: mediatek: Add USB wakeup driver

2017-12-09 Thread Chunfeng Yun
This driver is used to support usb wakeup which is controlled by the glue layer between SSUSB and SPM. Usually the glue layer is put into a system controller, such as pericfg module, which is represented by a syscon node in DTS. Due to the glue layer may vary on different SoCs, it's useful to

[PATCH 1/7] soc: mediatek: Add USB wakeup driver

2017-12-09 Thread Chunfeng Yun
This driver is used to support usb wakeup which is controlled by the glue layer between SSUSB and SPM. Usually the glue layer is put into a system controller, such as pericfg module, which is represented by a syscon node in DTS. Due to the glue layer may vary on different SoCs, it's useful to