On 2015年03月28日 08:58, YiPing Xu wrote:
在 2015/3/27 16:30, Xinwei Kong 写道:
On 2015/3/26 17:14, YiPing Xu wrote:
在 2015/3/25 15:50, Xinwei Kong 写道:
From: kongxinwei
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal frame
On 2015年03月28日 08:58, YiPing Xu wrote:
在 2015/3/27 16:30, Xinwei Kong 写道:
On 2015/3/26 17:14, YiPing Xu wrote:
在 2015/3/25 15:50, Xinwei Kong 写道:
From: kongxinwei
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal frame
在 2015/3/27 16:30, Xinwei Kong 写道:
On 2015/3/26 17:14, YiPing Xu wrote:
在 2015/3/25 15:50, Xinwei Kong 写道:
From: kongxinwei
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling d
On 2015/3/26 17:14, YiPing Xu wrote:
> 在 2015/3/25 15:50, Xinwei Kong 写道:
>> From: kongxinwei
>>
>> This patch adds the support for hisilicon thermal sensor, within
>> hisilicon SoC. there will register sensors for thermal framework
>> and use device tree to bind cooling device.
>>
>> Signed-off
在 2015/3/25 15:50, Xinwei Kong 写道:
From: kongxinwei
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: Leo Yan
Signed-off-by: kongxinwei
---
drivers/the
From: kongxinwei
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.
Signed-off-by: Leo Yan
Signed-off-by: kongxinwei
---
drivers/thermal/Kconfig| 8 +
drivers/t
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