Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

2017-09-04 Thread Daniel Lezcano
On 04/09/2017 08:39, Wangtao (Kevin, Kirin) wrote: > > > 在 2017/9/1 2:24, Daniel Lezcano 写道: >> On 29/08/2017 10:17, Tao Wang wrote: >>> From: Tao Wang >>> >>> This adds documentation of device tree bindings for the >>> thermal sensor controller of hi3660 SoC. >>> >>> Signed-off-by: Tao Wang >>

Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

2017-09-03 Thread Wangtao (Kevin, Kirin)
在 2017/9/1 2:24, Daniel Lezcano 写道: On 29/08/2017 10:17, Tao Wang wrote: From: Tao Wang This adds documentation of device tree bindings for the thermal sensor controller of hi3660 SoC. Signed-off-by: Tao Wang --- .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 +++

Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

2017-08-31 Thread Daniel Lezcano
On 29/08/2017 10:17, Tao Wang wrote: > From: Tao Wang > > This adds documentation of device tree bindings for the > thermal sensor controller of hi3660 SoC. > > Signed-off-by: Tao Wang > --- > .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 > ++ > 1 file changed,

[PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

2017-08-29 Thread Tao Wang
From: Tao Wang This adds documentation of device tree bindings for the thermal sensor controller of hi3660 SoC. Signed-off-by: Tao Wang --- .../devicetree/bindings/thermal/hisi-tsensor.txt | 37 ++ 1 file changed, 37 insertions(+) create mode 100644 Documentation/devicet