I do a lot of double sided boards with ground planes on both sides, so I do
a lot of stitching - and here is how I do it:
Place a free pad off the board. Select, copy, paste, copy, paste, etc.
This replicates (doubles each time) the quantities each time until I have
about the number of 'stitches
On 03:31 PM 21/02/2001 -0800, Dennis Saputelli said:
>I'm sure that filling vias with solder will enhance via reliability, but
>wave soldering seems to be going by the wayside (albeit slowly).
>for thru hole stuff people are going to intrusive (or invasive)
>soldering which is squirting a bit past
Bruce,
the issue of thermal stress cracking was not directly related to the
thermal reliefs of vias. The thermal stress cracking was the reason for
filling the vias with solder to supply a more reliable via under thermal
extremes. The thermal relief just allowed easier soldering of the via
I do a lot of double sided boards with ground planes on both sides, so I do
a lot of stitching - and here is how I do it:
Place a free pad off the board. Select, copy, paste, copy, paste, etc.
This replicates (doubles each time) the quantities each time until I have
about the number of 'stitches
I'm sure that filling vias with solder will enhance via reliability, but
wave soldering seems to be going by the wayside (albeit slowly).
for thru hole stuff people are going to intrusive (or invasive)
soldering which is squirting a bit paste in the hole and then putting
thru the oven with the res
