; -Original Message-
> From: [EMAIL PROTECTED] [mailto:[EMAIL PROTECTED]]
> Sent: 23 August 2001 12:34
> To: Protel EDA Forum
> Cc: [EMAIL PROTECTED]; [EMAIL PROTECTED]; [EMAIL PROTECTED]
> Subject: Re: [PEDA] Antwort: tenting vias;what Intel says
>
>
> In a message d
In a message dated 8/23/2001 4:03:21 AM Eastern Daylight Time,
[EMAIL PROTECTED] writes:
> [EMAIL PROTECTED]
Here's an excerpt from one of Intel's datasheet concerning the tenting of BGA
vias:
"Intel recommends tenting the via’s on the
bottom side of the board to minimize heat transfer to the
Hello Ivan.
tent the vias. You will most probably risk short under the BGA if you
don't. By the way, I never understood why many PCB designs come with open
vias, unless you want to use them as testpoints.
Regards,
Gisbert Auge
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