Dear Colleagues, [Apologies if you receive multiple copies of this message]
We would like to inform you that the paper submission deadline for SenSys/BuildSys2020 Joint Doctoral Colloquium has been extended to ** October 1st, 2020, 12:00 pm (Noon) - Pacific Time **. [Important Dates] * Submission Deadline: October 1st, 2020, 12:00 pm (Noon) - Pacific Time (** Extended ** ) * Notification of Acceptance: October 10th (Saturday), 2020 * Camera Ready Deadline: October 16th (Friday), 2020, 12:00 pm (Noon) - Pacific Time http://sensys.acm.org/2020 http://buildsys.acm.org/2020/ We are looking forward to your submissions. =========================================================================== Call for Participation: ACM SenSys/BuildSys 2020 Joint Doctoral Colloquium =========================================================================== The SenSys/BuildSys 2020 Joint Doctoral Colloquium provides an opportunity for doctoral students to explore and develop their research interests in an interdisciplinary workshop, under the guidance of a panel of distinguished researchers. The Forum provides an excellent opportunity for Ph.D. students to present their dissertation research, including work in progress, to the wider embedded networked sensor systems community. This meeting offers an opportunity to share experiences with other Ph.D. students and meet with accomplished international researchers and obtain feedback from them. Accepted Ph.D Forum (Doctoral colloquium) abstracts will be included into ACM SenSys/BuildSys Digital Library. [Best Doctoral Colloquium Presentation Award] *** All the presenters will be eligible to compete for the Best PhD Forum Presentation Award, provided that your abstract is accepted. *** [Free Registration] *** Conference registration is free this year. Please remember to register asap. *** [Important Dates] * Submission Deadline: October 1st, 2020, 12:00 pm (Noon) - Pacific Time (** Extended ** ) * Notification of Acceptance: October 10th (Saturday), 2020 * Camera Ready Deadline: October 16th (Friday), 2020, 12:00 pm (Noon) - Pacific Time * Doctoral Consortium Day(s): TBA [Submission Detail] * The paper should not exceed 2 pages. * Submission template format should follow ACM Master Article Template (with sigconf setting). * Submissions do not need to be anonymous and should have the PhD student as the sole author. * SenSys submission system: https://sensys20phd.hotcrp.com/ * BuildSys submission system: https://buildsys20phd.hotcrp.com/ [Technical Program Committee/Panelist] SenSys: * Hua Huang (UC Merced) * Tong Yu (Samsung Research USA) * Rasit Eskicioglu (University of Manitoba) * VP Nguyen (University of Texas at Arlington) * Chenren Xu (Peking University) * Chris Xiaoxuan Lu (the University of Edinburgh) BuildSys: TBD [Review & Publication] * All publications will be peer reviewed together with their contribution to the topic of the Ph.D. forum. * The accepted papers will be published in the SenSys/BuildSys 2020 adjunct proceedings, respectively, which will be included in the ACM Digital Library. [Joint Organization] SenSys Organizer: * Sozo Inoue (Kyushu Institute of Technology, Japan) * Shijia Pan (University of California Merced, USA) BuildSys Organizer: * Susu Xu (Stony Brook University, USA) Secretary: * Tahera Hossain (Kyushu Institute of Technology, Japan) =========================================================================== SenSys2020 goes to entirely online: We've been monitoring the progress of COVID-19 pandemic. It is a very dynamic target and the risk of mass physical gathering remains high. Putting the wellbeing of the community above all, we, the entire OC and SC, have decided to take SenSys2020 entirely virtual. With the change, we'll also be able to offer a discount registration fee while you worry less about travel restrictions/costs. Therefore, please do not hesitate to contribute your latest research result to the conference! We believe the decision is the best, albeit difficult, for us all, and the local OC members hope sincerely that there will be other opportunities to welcome you all to Japan. Kind regards, Yuuki ----- Yuuki Nishiyama, Ph.D. Research Associate Institute of Industrial Science The University of Tokyo E-mail: yuu...@iis.u-tokyo.ac.jp URL: https://www.yuukinishiyama.com/ _______________________________________________ uai mailing list uai@engr.orst.edu https://it.engineering.oregonstate.edu/mailman/listinfo/uai
