Putting out some feelers on this one. NFPA 318 requires a .2/3000 in fabrication areas in semi-conductor manufacturing facilities. We're trying to quantify the system area limitation and not everyone is on the same page. NFPA 13 is cited for design criteria beyond what is in 318, but the system protection area limits are based on occupancy groups or high piled storage. Obviously the density corresponds to OH II (52k) but the area of application doesn't. We're still way below an extra hazard level of protection looking at the curve, but falling in the no mans land in between in total water demand I'm not sure if it's still reasonable to use 52k square feet as our benchmark. It doesn't seem totally unreasonable since we could run into the same density/area combo in a OH II facility with combustible concealed spaces etc. Anyone have thoughts or better yet direct experience with this? The applicable standards are NFPA 318 - 2018, NFPA 13 - 2019 and IFC - 2019.
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