FYI.

---------------
Hi Carlos,

I would appreciate if you would please distribute the below CFP for  
IEEE COMCAS 2013.

Thank you and best regards,

Doug

> -------- Original Message --------
> Subject:      IEEE COMCAS 2013 - New deadline for Submission May 5, 2013
> Date: Wed, 10 Apr 2013 13:23:35 +0300
> From: IEEE COMCAS 2013 <[email protected]>
> Reply-To:     [email protected]
> To:   [email protected] <[email protected]>
>
> If you cannot see this email properly, please click here
> New deadline for Submission: May 5, 2013
>
>
> Organizing Committee
> Conference Chair:
> Shmuel Auster
> Elta Systems Ltd, Israel.
> IEEE AP/MTT Chapter Chair
>
> Technical Program Chair and
> Co-chairs:
> Stephen B. Weinstein
> Communication Theory &
> Technology Consulting, USA
> Richard V. Snyder
> RS Microwave, USA
> Peter de Maagt
> European Space Agency,
> The Netherlands
> Lance M. Kaplan
> US Army ARL, USA
>
> Publications Chair:
> Benjamin Epstein
> OpCoast LLC, USA
>
> Electronic Submissions Chair:
> Matthias Rudolph
> BTU Cottbus, Germany
> Global Administration:
> James Rautio
> Sonnet Software, USA
>
> Exhibition Chair:
> Oren Hagai
> Interlligent, Israel
>
> Members at large:
> Barry S. Perlman
> US Army CERDEC, USA (ret.)
> Richard Sparks
> IEEE MTT Society
> Douglas N. Zuckerman
> IEEE Communications Society
> Elya Joffe
> IEEE PSES & EMCS Societies
>
> Treasurer:
> Itzhak Shapir
> Elta Systems Ltd., Israel
>
> Local Arrangements Chair:
> Itai Voller
> AEAI, Israel
>
> WWW.COMCAS.ORG
>
> Secretariat:
>
> Ortra Ltd.
> 1 Nirim Street, P. O. Box 9352
> Tel-Aviv 61092, Israel
> Tel: +972-3-6384444
> Fax: +972-3-6384455
> Email: [email protected]
>
> IEEE COMCAS 2013 continues the tradition of providing a  
> multidisciplinary forum for the exchange of ideas, research results,  
> and industry experience in the areas of microwaves, communications,  
> antennas, solid state circuits, electromagnetic compatibility,  
> electron devices, radar and electronic systems engineering. It  
> includes a technical program, industry exhibits, and invited talks  
> by international experts in key topical areas.
>
> The conference will take place on October 21-23, 2013 in Tel Aviv,  
> Israel. The David Intercontinental Hotel on the Mediterranean Sea  
> offers an excellent venue for networking and the candid exchange of  
> ideas.
> Papers are solicited in a wide range of topics including:
> Aeronautical and space applications and challenges
> Analog/digital RF circuits and systems
> Antennas (components, modeling, micro & macro scale)
> Automotive and transportation radar and communications
> Biomedical applications (body area systems, scanning
>   devices, telemedicine)
> CAD techniques for microwave and communications devices
> Circuit theory, modeling and applications
> Cognitive radio and spectral sharing technologies
> Electromagnetic compatibility
> Fifth generation mobile communication
> Filters and Multiplexers
> First responder and military communication, sensing and
>    information retrieval systems
> Environmentally sensitive design ("green" communications,
>   electromagnetic, and antenna systems)
> MEMS modeling, devices and applications
> Microcell, picocell and femtocell devices, systems and
>   applications
> Microwave and millimeter wave circuits and
>   technologies
> Microwave imaging and tomography
> MIMO (multiple antenna systems for communications
>  and radar)
> Modulation and signal processing technologies
> Nanotechnologies and applications
> Optical/wireless convergence and integration; radio
>   over fiber
> Radar signal processing
> Radar techniques, systems and applications
> RFID devices, technologies, systems and applications
> RF power amplifiers and devices
> Sensor networks and technologies
> Software-defined radio and multiple air interface
>   devices
> Solid-state devices, RFICs
> Spatial coding
> Terahertz technologies and systems
>
> Regular oral presentations will be 20 min. in length; there will  
> also be Poster sessions.
> All submitted papers will be peer reviewed and assessed on key  
> accomplishments, technical contribution, and advancement of the  
> state-of-the-art, originality and interest to the attendees.
> Accepted papers will be published in the COMCAS2013 Proceedings  
> which will be submitted for publication in IEEE Xplore® after the  
> conference.
>
> Submission of papers:
> English-language manuscripts, no longer than five pages including  
> figures and references, must be submitted using the IEEE MS Word  
> template available at
> http://www.ieee.org/conferences_events/conferences/publishing/templates.html
> See author instructions at www.comcas.org
>
> Important deadlines:
> Submission of manuscript:
> Notification of acceptance/rejection:
> Submission of final camera-ready paper:
> Early bird (lower cost) registration:
> May 5, 2013
> July 1, 2013
> August 1, 2013
> August 30, 2013
>
>
> Technical Exhibition:
> The technical program will be complemented with a technical  
> exhibition, which will be held on
> October 21-22, 2013 offering companies and agencies a unique  
> opportunity to visit Israel and
> present related products and services in display and printed advertisement.
> For further details please contact the Conference Secretariat.

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