More on the infamous RoHS subject:
-> Most RoHS parts are indeed compatible with your good old tin solder.
But I know for a fact that some RoHS BGA chips (surface mount Ball Grid
Array) will not be correctly mounted with a standard Pb process; the reason is
that the ball under the BGA package need to melt and fusion with the solder
deposit, and that can only happen at RoHS temperature (higher than standard Pb
process).
That should not affect the average Nixie hobbyist.
-> FR4 material for PCB is not a problem with RoHS, you just need to use a
higher temperature grade FR4, for instance TG150 (good for 150 °C) instead of
regular TG135.
-Marc-
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