ED,

Thanks. That clears things up!

At 12:23 PM 9/23/2009, you wrote:
The Rb physics package and associated ovens in the LPRO are thermally isolated from the baseplate. The only heat sources attached to the baseplate are a couple of TO-220 devices. So the baseplate is acting as an ordinary heatsink for them.

The 70C maximum rating for the baseplate is likely based on typical heat losses from the other parts of the device. If the baseplate (which is easy to measure) is kept below 70C, the rest of the device (which is inaccessible) should be okay.

Ed

steve gunsel wrote:
I'm new to this, but it sounded more like this is to be a thermal mass to minimize temperature swings. Why would you want to efficiently cool something that you are trying to heat and maintain at a constant temperature?

just curious in Medina, OH


At 11:12 AM 9/23/2009, you wrote:
At 10:51 AM 9/23/2009, J. Forster wrote...
Monsterously thick will NOT do it. All that does is increase the heat
capacity of the HS, not it's ultimate thermal resistance (W/deg).

You need surface area...

You need both. A 10 m x 10 m piece of aluminum foil won't do much, either, despite having a very large surface area.

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