Hi

The traditional approach was to seal the unit up at the base. You 
then baked it out (possibly at 125C) for some period of time (maybe 24 
to 48 hours). After that you sealed off the magic hole in the package. 

In some cases there was indeed a magic pot under the solder hole that
was used to do a final “tweak” on the oven or the EFC set point. I’d bet that
there are *some* (but not all) 260’s out there with a teak under the hole. The
“no EFC” variant would be a good bet ….

Bob

> On May 29, 2015, at 2:53 PM, cdel...@juno.com wrote:
> 
> Hi,
> 
> I've noticed that there is a soldered area on the top of the module that
> appears to be covering a hole. Has anyone taken one of these apart, and
> if so is there a trim cap or pot under this hole to allow adjustment???
> 
> Thanks,
> 
> Corby Dawson
> 
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