Hi, Attila!

Somewhere you'll have to produce sharp differential edges and this
semi-analogue stuff is probably hard on a chip shared with thousands of
other gates and a digital process. Going differentially into the chip will
reduce the effects of ground bounce etc a lot.

This is what you can expect from an ADCMP580 on a homebrew
board and soldered-in semi rigid cable:
< https://www.flickr.com/photos/137684711@N07/33305853110/in/album-72157662535945536/ >

Some will cry: eeek - a comparator, and an ECL or CML one at that, but in the end it is just a differential amplifier like that Wenzel design, made by people who
know their SiGe process.

If you have a slowly rising source, you'll need multi-stage slope amplification and low pass filtering in Collins style anyway which will be safer to do off-chip.

If you can specify the interface, go for something speedy, then
the guys who do the the signal source have the hard time and
can be pointed at.  :-))

regards, Gerhard



Am 27.03.2017 um 18:05 schrieb Attila Kinali:
Hi,

We (the group I am with and a group at TU Vienna) are currently designing
an ASIC (digital 65nm process) that will contain a TDC part. The TDC will
be a simple delay line TDC design using differential buffers, which we
expect to give us something in the order of 20ps of resolution (hopefully
better, but we will not know until we get post-layout simulation data).
We are loosely following the design CERN came up with for their new TDC chip[1].


Now, the TDC expects a differential input, but the system gets single-ended
pulses as input (50R coax input, level likely to be CMOS 3.3V, but level not
fixed yet, ie can be freely choosen). I can either convert these single-ended
signals into differential off-chip or on-chip. Unfortunately, I lack knowledge
and experience to judge either approach. The issues I see are:

* Single-ended input in a chip might lead to shifting ground potential
   on the chip and thus to measurment jitter.
* There are different architectures to preform the single-ended to differential
   conversion on-chip, but I have no clue which one to choose or even how
   to judge them without extensive simulations for which we do not have the
   time, know-how and probably not even the tools.
* Conversion to differential off-chip means another component off-chip
   that might introduce additional delay uncertainty (our application is
   very sensitive to that) and an unknown amount of jitter.

My google foo has been so far not strong enough to find answers to these
questions.

I would appreciate if someone could give me some hints in this matter
or tell me where I could find appropriate literature and maybe even
tell me whether I am missing anything.

Thanks in advance

                                Attila Kinali

[1] 
https://indico.cern.ch/event/228972/contributions/1539621/attachments/378552/526492/TDC_TWEPP_2013.pdf


_______________________________________________
time-nuts mailing list -- time-nuts@febo.com
To unsubscribe, go to https://www.febo.com/cgi-bin/mailman/listinfo/time-nuts
and follow the instructions there.

Reply via email to