On 05/16/2016 02:51 PM, Masahiro Yamada wrote:
> Synopsys DWC3 IP generally works with an SoC-specific glue layer.
> DT binding for that is like this:
>
> usb3_glue {
> compatible = "foo,dwc3";
> ...
>
> usb3 {
> compatible = "snps,dwc3";
> ...
> };
> };
>
> The glue layer initializes some SoC-specific parts, then populates
> the child DWC3 core. To see how it works, refer to
>
> drivers/usb/dwc3/dwc3-exynos.c
> drivers/usb/dwc3/dwc3-keystone.c
> drivers/usb/dwc3/dwc3-omap.c
> drivers/usb/dwc3/dwc3-st.c
>
> of Linux Kernel.
>
> This commit implements a driver compatible with "snps,dwc3", allowing
> to use the same binding in U-Boot. The glue layer can be simply
> implemented based on Simple Bus Uclass.
>
> Signed-off-by: Masahiro Yamada <yamada.masah...@socionext.com>
> Reviewed-by: Marek Vasut <ma...@denx.de>
> ---
Applied, thanks!
--
Best regards,
Marek Vasut
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