Hi Simon
On 7/11/21 2:01 AM, Simon Glass wrote:
Hi Patrick,
On Thu, 8 Jul 2021 at 03:17, Patrick Delaunay
<patrick.delau...@foss.st.com> wrote:
In next TF-A version the stm32mp1 platform will support the Firmware
Image Package (FIP) [1], a container filled with:
- the U-Boot binary = u-boot-nodtb.bin
- the U-Boot device tree = u-boot.dtb
- the Secure OS (OP-TEE) or the secure monitor (SP_MIN)
That sounds like a job for FIT?
Yes it is the same purpose but at TF-A BL2 level, so before U-Boot
execution.
In the STM32MP boot chain with TF-A, we have:
1/ Rom code load TF-A BL2 in embedded RAM
=> it running in secure world, initializing the DDR
2/ TF-A BL2 load the next SW component from FIP containers in DDR
a) secure world, OP-TEE for example, including key infrastructure.
b) normal world = OS loader : U-Boot + device tree
But SPL is not used....
TF-A BL2 can be see as SPL a remplacant and
a FIP loaded by TF-A BL2 is equivalent to FIT loaded by SPL,
it the container supported by trusted firmware
But even in this use case FIT can be use to load kernel by U-Boot...
It was a long debate on the preferred first stage bootloader
for STMicroelectronics ARMv7 platform, between TF-A BL2 and SPL .
Today the preferred solution is TF-A BL2 with FIP, for secure boot
support and long term integration with OP-TEE, even is we lost
the falcon mode.
Regards,
Simon
Regards
Patrick
