On Thu, Apr 04, 2024 at 10:20:21AM +0530, Neha Malcom Francis wrote:
> On 03/04/24 17:33, Dhruva Gole wrote:
> > From: Kamlesh Gurudasani <kaml...@ti.com>
> >
> > Add support for signing of TIFSSTUB images for HSSE, HSFS and GP devices
> > and include them in tispl.bin and tispl.bin_unsigned.
> >
> > Signed-off-by: Kamlesh Gurudasani <kaml...@ti.com>
> > Signed-off-by: Dhruva Gole <d-g...@ti.com>
[...]
> > @@ -270,7 +406,8 @@
> > conf-0 {
> > description = "k3-am625-sk";
> > firmware = "atf";
> > - loadables = "tee", "dm", "spl";
> > + loadables = "tee", "tifsstub-hs",
> > "tifsstub-fs",
> > + "tifsstub-gp", "dm", "spl";
> > fdt = "fdt-0";
> > };
> > };
>
>
> If there are multiple boards that will support TIFSSTUB in future, I would
I would assume that this will be the case. Verdin AM62 would need the
same, for example.
Francesco
