Dear users,
I am working with deal.ii step-26 to implement temperature
dependent thermal diffusivity. Currently for thermal diffusivity values >
order of 1e-2 the results are quit satisfactory but if I use the low
thermal diffusivity values like the order of 1e-6 to 1e-3, I get
temperature oscillations (temperature going to -ve value even with all
positive temperature initial and boundary conditions in domain and at
boundaries).
If anyone has faced the same issue in thermal conduction simulations or
knows the criteria to keep simulation stable in terms of thermal
diffusivity, time step and mesh size then kindly suggest and share the
opinion. Thank you in advance!
Regards,
Mashhood
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