Mel, 

I notice you mentioned that European labs are using a working voltage of
150 Vdc which requires 1.6 mm creepage. I have assumed they were using 125
Vdc which requires only 1.5 mm. Probably the safest course is to go for the
higher 1.6 mm unless the product is destined for a country requiring 230
volt Supplementary Insulation.

Can anyone confirm what working voltage labs are using for Basic Insulation
of TNV circuits?

Regards
Barry Esmore

----------
> From: Mel Pedersen <mpeder...@midcom.anza.com>
> To: emc-p...@majordomo.ieee.org; 'Diaco Davari' <dav...@pmc.philips.com>
> Subject: RE: Crepage/Clearance On Telecom Modem design
> Date: Friday, 9 October 1998 11:51
> 
> I believe that your experts are wrong...4.2 is a rather odd number to
come up with.  The most common requirement here is SUPPLEMENTARY INSULATION
for a PRIMARY CIRCUIT at 250Vrms (as defined by EN 60950) between the
TIP/RING (line side, or TNV-3 side) and the modem or device side. 2.5mm of
surface creepage and 2.0mm of air clearance is required here.  This assumes
that your modem or device side already has sufficient isolation from Mains,
which is almost always the case.
> 
> Many countries in Europe require only BASIC INSULATION at a working
voltage of 150VDC, which equates to a 1.6mm creepage spacing requirement. 
This also assumes that you have sufficient isolation from Mains to you
modem.
> 
> If you don't have sufficient isolation from Mains, your requirement will
be 5.0mm.  This would be consistent with the REINFORCED INSULATION
requirement between Mains and the Tip/Ring side.
> 
> It is possible that your consultants are correct for your particular
case...however, it would be a very unusual case...
> 
> They are correct about one thing...EN 60950 is the correct standard.
> 
> feel free to call if you have any further questions,
> 
> Mel Pedersen                            Midcom, Inc.
> Homologations Engineer             Phone:  (605) 882-8535
> mpeder...@midcom-inc.com     Fax:  (605) 882-8633
> 
> I disclaim anything that may be wrong.
> 

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