Hello All,
The current RoHS Directive has the following exemption for Pb (Annex, Item 7): 7. — Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead), — lead in solders for servers, storage and storage array systems (exemption granted until 2010), — lead in solders for network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication, — lead in electronic ceramic parts (e.g. piezoelectronic devices). I would be interested in any rumors or opinions on the longevity of this exemption. Our US-based customers are very firm in their requirements for Tin-Lead solder but our marketing types are concerned that the exemption (particularly the 3rd dash) will be removed. Any data would be much appreciated. Thanks, Marko Marko Radojicic Manager, Qualifications and Regulatory StrataLight Communications, Inc. 151 Albright Way Los Gatos, CA 95032 [email protected] Desk: 408.385.3033 Cell: 650.575.3865 - ---------------------------------------------------------------- This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. Website: http://www.ieee-pses.org/ To post a message to the list, send your e-mail to [email protected] Instructions: http://listserv.ieee.org/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas [email protected] Mike Cantwell [email protected] For policy questions, send mail to: Jim Bacher: [email protected] David Heald: [email protected] All emc-pstc postings are archived and searchable on the web at: http://www.ieeecommunities.org/emc-pstc
