And here's Jean-Louis Gassée's take on this mess: http://www.mondaynote.com/2011/05/08/intel-3-d-transistors-why-and-when/
...A side note: Many of the chip engineers I've spoken with regard Intel's "3D" announcement as simply hype. Transistors, on an integrated circuit, have always been made with *layers* of doping material - so really, they've always been "3D"! And many chips have functional layers on top of that... I guess it's possible that Intel ultimately intends to make uber thick chips ?cubes?. Not sure how that jives on the "macro" scale, of products being engineered to be thinner and thinner tho.
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