Oh, maybe I should clarify: The pcb I am recreating has components with square pads: that is what I am trying to do. I have done this by placing a rectangle around a via in the component layer and also in the solder layer. I am using the component layer as my "top" layer and the solder layer as my "bottom" layer. I am then eliminating the clearance between the via and the copper. Is this the wrong way to do this?
Also, if I wanted to have this manufactured and I only wanted to pay for a two layer board (after all, the original pcb is only two layers), would I only want to use the "component" and "solder" layers for the board? This would mean I would place the bottom-side traces in the groundplane (with some clearance, of course)...is this correct? I am still a little confused. Thanks a lot, Jeremy
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