On Tue, Jun 24, 2008 at 1:12 PM, Robert Butts <[EMAIL PROTECTED]> wrote:
> I'm about to start bread boarding a desin. I have a few surface mount chips > that I got SMT-to-DIP adapters for. I also purchased SMT paste. I have > never worked with surface mount devices. How do you paste the chip to its > footprint? How do you get the excess, if any, paste out? I have a > feeling it's got something to do with heating it. > Thanks, > Rob > I use wire solder, water soluble flux and a fine tip soldering iron. A list of the tools and supplies I use are at* http://tinyurl.com/6b2vy9 (* jcl *) * -- http://www.luciani.org
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