Thanks everyone. The Project: I'm a quadriplegic and during the summer I have difficulty regulating my temperature and am usually restricted to indoors and air condition when the outdoor temperature exceeds 80 degrees. I've been working on a design to mount a thermoelectric cold plate in the backrest of my wheelchair. This cold plate will have the capability of cooling or heating via a PWM controlling an h-bridge. I'm using a microchip dsPIC DSC to monitor thermocouples in the backrest, interface to the user and control the power to the cold-plate. I'm about 80% done with the code and trying to get my spare chair prototyped while the summer is still here (central Massachusetts).
On Tue, Jun 24, 2008 at 1:29 PM, John Luciani <[EMAIL PROTECTED]> wrote: > > > On Tue, Jun 24, 2008 at 1:12 PM, Robert Butts <[EMAIL PROTECTED]> > wrote: > >> I'm about to start bread boarding a desin. I have a few surface mount chips >> that I got SMT-to-DIP adapters for. I also purchased SMT paste. I have >> never worked with surface mount devices. How do you paste the chip to >> its footprint? How do you get the excess, if any, paste out? I have a >> feeling it's got something to do with heating it. >> Thanks, >> Rob >> > > I use wire solder, water soluble flux and a fine tip soldering iron. A list > of the tools > and supplies I use are at* http://tinyurl.com/6b2vy9 > > (* jcl *) > * > > > > > -- > http://www.luciani.org > > > _______________________________________________ > geda-user mailing list > geda-user@moria.seul.org > http://www.seul.org/cgi-bin/mailman/listinfo/geda-user > >
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