In my continuing learning experience with creating/modifying footprints I have run into the following problem. Using the inputs form several other users I created my first footprint, a 16 pin DIP with oval pads (thanks to all). Then I wanted to create 8, 14, 18, etc pins footprints. I selected my 16 pin footprint into the buffer and selected the "break buffer elements to pieces" like the manual said. I ended up with my original vias (pins), component side lines (pads) and silk screen, but NO solder side lines (pads). Why did the solder side disappear when executing the "break buffer elements to pieces" command?
Jeff wd4nmq _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user