On Sun, 2008-09-28 at 13:08 -0400, tj wrote: > In my continuing learning experience with creating/modifying footprints > I have run into the following problem. Using the inputs form several > other users I created my first footprint, a 16 pin DIP with oval pads > (thanks to all). Then I wanted to create 8, 14, 18, etc pins footprints. > I selected my 16 pin footprint into the buffer and selected the "break > buffer elements to pieces" like the manual said. I ended up with my > original vias (pins), component side lines (pads) and silk screen, but > NO solder side lines (pads). Why did the solder side disappear when > executing the "break buffer elements to pieces" command?
That probably isn't intended. Could you open a bug in PCB's bug tracker: http://sourceforge.net/tracker/?group_id=73743&atid=538811 Best wishes, -- Peter Clifton Electrical Engineering Division, Engineering Department, University of Cambridge, 9, JJ Thomson Avenue, Cambridge CB3 0FA Tel: +44 (0)7729 980173 - (No signal in the lab!) _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user