Hi, I'm using a high-power TSSOP24 that needs a thermal paddle under it. The unusual thing about this is that the recommended solder mask on the paddle has less clearance in the X direction than in the Y direction. How would one do this in PCB?
MFG dimensions for the pad are 3.4 x 7.8 mm, while the mask opening is supposed to be 2.4 x 4.48 mm. I came up with this pad specification: Pad[ 0 -8660 0 8660 13385 1000 9448 "25" "25" 0x00000100] which has the proper amount of copper, but allows the mask opening to be taller than it's supposed to be. Thanks for any insight, Eric _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user