On Thu, Jan 8, 2009 at 6:48 PM, Eric Brombaugh <ebrombau...@cox.net> wrote: > Hi, > > I'm using a high-power TSSOP24 that needs a thermal paddle under it. The > unusual thing about this is that the recommended solder mask on the > paddle has less clearance in the X direction than in the Y direction. > How would one do this in PCB?
I wonder if a couple of overlapping pads would work. (* jcl *) -- http://www.luciani.org _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user