I'm evaluating various layout packages to replace the commercial package I'm currently using. I've been playing with gEDA/PCB for a couple days and reading the documentation and I'm unclear if it can handle solder paste layer shapes that are dissimilar to the pads. For example, IPC recommends "home plate" shaped polygons for solder paste apertures for chip components to reduce solder balling during reflow. Somewhat complicated patterns are also used for printing paste for through hole reflow components (pin-in-paste). It doesn't look to me like the file structure for elements contain solder paste (or soldermask for that matter) information. How do people handle this? Thanks, -- Scott Post [1]scott.e.p...@gmail.com
References 1. mailto:scott.e.p...@gmail.com
_______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user