timecop <time...@gmail.com> writes: >> Yep, look for example, at X2/C10 (at X=3426, Y=2381) it is so close to X2/R9 >> and X2/R5. How will you avoid solder bridges there? In fact, the solder > > well, that particular area doesnt matter since they're actually > connected together anyway but yeah i agree placing pads THAT close > together is bogus. > >> Minor point - in the area where the layer numbers are visible, "1 2 3 4 5 >> 6", the "6" is mirror imaged.
Yes, that is intentional, so it can be read from the back side :-) I should mirror the 4 and 5 too, maybe. > > lol. this is a 6 layer board? it could probably be hand-routed on 2 > layer and if design actually needs 4 layer for whatever reason, but 6? > wtf. Grounding. High speed. EMI .... see my long post where I explain what this board shall do. The preamp that shall drive the inputs to this board has a gain-bandwidth of 1GHz (ADA4817). I tried with 4 layers and gave up at some point. It can be done, but compromises some of the issues mentioned for no good reason. Any reason not to use six layers, except for slightly higher cost? -- Stephan _______________________________________________ geda-user mailing list geda-user@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-user